By Betty Prince

The huge scale integration and planar scaling of person method chips is achieving a dear restrict. If person chips now, and later terrabyte reminiscence blocks, reminiscence macros, and processing cores, should be tightly associated in optimally designed and processed small footprint vertical stacks, then functionality might be elevated, strength decreased and value contained. This e-book studies for the electronics engineer, specialist and scholar the severe components of improvement for 3D vertical reminiscence chips together with: gate-all-around and junction-less nanowire thoughts, stacked skinny movie and double gate memories,  terrabit vertical channel and vertical gate stacked NAND flash, huge scale stacking of  Resistance RAM cross-point arrays, and 2.5D/3D stacking of reminiscence and processor chips with through-silicon-via  connections now and distant hyperlinks later.

Key features:

  • Presents a evaluation of the prestige and traits in third-dimensional vertical reminiscence chip technologies.
  • Extensively stories complex vertical reminiscence chip know-how and development
  • Explores expertise technique routes and 3D chip integration in one reference

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