By Geraldine Cogin Shwartz,Geraldine C. Schwartz,Kris V. Srikrishnan

First brought a couple of decade in the past, the 1st version of the Handbook of Semiconductor Interconnection Technology grew to become greatly renowned for its thorough, built-in therapy of interconnect applied sciences and its forward-looking standpoint. the sector has grown significantly in the meanwhile and plenty of of the "likely instructions" defined within the first variation at the moment are general in glossy amenities. Reflecting these advances, this version delves into the sensible elements of interconnections for production. It examines the interconnect and fabrication applied sciences now to be had, with an exam of destiny clients for the field.

What's in this Edition:


  • Detailed dialogue of electrochemical gear for plating copper

  • Information on instruments used for evaporation, chemical vapor deposition, and plasma processes

  • Emphasis on size of mechanical and thermal homes of insulators

  • Methods for characterizing porous dielectric skinny films

  • Greater specialize in integration matters and houses of titanium, cobalt, and nickel silicides

  • Process schemes in keeping with the elevated desire for without boundary lines touch gates and source/drain

  • Expanded dialogue on offerings for low-dielectric insulators

  • Concentration on electroplated copper, specifically morphology of plated motion pictures and their properties

  • Developments in skinny movie liners and barriers

  • Expanded fabric on copper reliability
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