By Aida Todri-Sanial,Jean Dijon,Antonio Maffucci

This booklet presents a single-source reference at the use of carbon nanotubes (CNTs) as interconnect fabric for horizontal, on-chip and 3D interconnects. The authors display the makes use of of bundles of CNTs, as leading edge accomplishing fabric to manufacture interconnect through-silicon vias (TSVs), with a view to increase the functionality, reliability and integration of 3D built-in circuits (ICs). This ebook could be first to supply a coherent evaluation of exploiting carbon nanotubes for 3D interconnects protecting points from processing, modeling, simulation, characterization and functions. insurance additionally contains a thorough presentation of the appliance of CNTs as horizontal on-chip interconnects which may almost certainly revolutionize the nanoelectronics undefined. This booklet is a must-read for somebody attracted to the cutting-edge on exploiting carbon nanotubes for interconnects for either 2nd and 3D built-in circuits.

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