By Hao Yu,Chuan-Seng Tan,Chuan Seng Tan

3D integration is an rising know-how for the layout of many-core microprocessors and reminiscence integration. This booklet, Advances in 3D built-in Circuits and Systems, is written to aid readers comprehend 3D built-in circuits in 3 phases: equipment fundamentals, process point administration, and genuine designs.

Contents provided during this ebook comprise fabrication strategies for 3D TSV and 2.5D TSI; gadget modeling; actual designs; thermal, strength and I/O administration; and 3D designs of sensors, I/Os, multi-core processors, and memory.

Advanced undergraduates, graduate scholars, researchers and engineers may well locate this article invaluable for realizing the various demanding situations confronted within the improvement and development of 3D built-in circuits and systems.

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